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Lam Research Corporation

Alain Harrus

Steven T Mayer

Evan E Patton

Robert J Contolini

Richard N Hill

David R Pirkle

Dean R Denison

Steve Taatjes

Jon Reid

An electrochemical reactor is used to electrofill damascene architecture for integrated circuits. A shield is used to screen the applied field during electroplating operations to compensate for potential drop along the radius of a wafer. The shield establishes an inverse potential drop in the electrolytic fluid to overcome the resistance of a thin film seed layer of copper on the wafer.

Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element

A chuck for processing a substrate includes a chuck body having a dielectric layer, the dielectric layer including a substrate receiving surface, the substrate receiving surface being at least as large as a substrate to be processed on the chuck. The chuck further includes an electrode buried in the chuck body, the electrode being larger than the substrate receiving surface such that edges of a radio frequency field generated by the electrode are all disposed beyond the substrate receiving surface. A method for depositing a film in a radio frequency biased plasma chemical deposition system is also disclosed.

Chuck for substrate processing and method for depositing a film in a

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Palo Alto, CA, United States of America

Alain Harrus