Sumitomo Bakelite Company Limited

Akira Tokoh

Etsu Takeuchi

Takashi Hirano

Toshiro Takeda

Nobuyuki Sashida

Naoshige Takeda

Toshio Banba

The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a polyamic acid) as a component for imparting improved adhesion, flexibility or heat resistance, and a diazoquinone compound and/or a dihydropyridine compound as a photosensitive agent. This photo-sensitive resin composition can form a pattern of high resolution and further has excellent adhesion and mechanical properties. The present invention further provides three novel diazoquinone compounds as a photo-sensitive agent, which compounds give high resolution, high contrast and thick-film formability when compounded in a positive photo-sensitive resin composition. The present invention furthermore provides a new type positive photo-sensitive resin composition obtained by reacting a polybenzoxazole precursor with a diazoquinone compound as a photo-sensitive agent. This photo-sensitive resin composition has excellent alkali resistance when unexposed to a light and accordingly can give a high residual film ratio.

Positive photo-sensitive resin composition comprising a photosensitive

The present invention provides a photosensitive resin composition which comprises as essential components: (A) a polyamic acid having a recurring unit represented by the following formula [I]: ##STR1## wherein 0.5-50 mol % of R.sub.1 consists of a silicone diamine residue represented by the following formula [II]: ##STR2## wherein n represents an integer of 1-50, and the remainder of 50-99.5 mol % of R.sub.1 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, and a heterocyclic group, and R.sub.2 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, a heterocyclic group, and a silicone group, and m represents 1 or 2, (B) an amide compound having carbon-carbon double bond, and (C) a photosensitizer. The present invention further provides a semiconductor apparatus in which the above composition is used.

Photosensitive resin composition and semiconductor apparatus using it

The present invention provides a photosensitive resin composition which comprises, as essential components:

Photosensitive resin composition with polyamic acid polymer

The present invention provides an oligomer having an inherent viscosity .eta. of 0.001-0.5 dl/g as measured at a concentration of 0.5 g/dl in N-methyl-2-pyrrolidone at 30.degree. C., which has been obtained by subjecting to polymerization and imidization (a) an acid component consisting of an aromatic tetracarboxylic acid dianhydride and/or a derivative thereof and (b) a diamine component consisting of 5-100 mole % of a diaminosiloxane represented by the undermentioned formula (I) and 95-0 mole % of an organic diamine other than the formula (I): ##STR1## wherein R.sub.1 is a divalent aliphatic group of 1-5 carbon atoms or a divalent aromatic group of 6 or more carbon atoms; R.sub.2 and R.sub.3 are each a monovalent aliphatic or aromatic group and may be the same or different; and m is an integer of 1-100, as well as an oligomer solution obtained by dissolving the above oligomer in an organic solvent.

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Tokyo, Japan

Akira Tokoh