Toyo Aluminium Kabushiki Kaisha

Akira Shingu

Mitsunari Ooyagi

Kiyoji Egashira

An aluminum alloy foil includes: aluminum; silicon; manganese; iron; zinc; copper; and magnesium. In the aluminum alloy foil, a total of a content of the silicon and a content of the iron is less than or equal to 0.1 mass %. In the aluminum alloy foil, a ratio of a mass of the manganese to a total mass of the silicon and the iron is more than or equal to 7.0. In the first surface, an area ratio of second phase particles each having an equivalent circle diameter of more than or equal to 1.5 μm is less than or equal to 0.1%.

Aluminum alloy foil, laminate, method of producing aluminum alloy foil, and method of producing laminate

Discussed is an aluminum foil for ultraviolet light reflecting materials, wherein a ratio of a total surface area of aluminum particles pressed into or adhering to a region having a predetermined surface area to the surface area of the region is less than or equal to 0.05%, the total surface area of crystallized products present in the region having a predetermined surface area is less than or equal to 2% with respect to the surface area of the region, an average surface area per crystallized product is less than or equal to 2 μm, and arithmetic surface roughness Ra of the region is less than 20 nm.

Aluminum foil for ultraviolet light reflecting materials and method for producing same

An aluminum alloy foil includes: aluminum; silicon; manganese; iron; zinc copper; and magnesium. In the aluminum alloy foil, a total of a content of the silicon and a content of the iron is less than or equal to 0.1 mass %. In the aluminum alloy foil, a ratio of a mass of the manganese to a total mass of the silicon and the iron is more than or equal to 7.0. In the first surface, an area ratio of second phase particles each having an equivalent circle diameter of more than or equal to 1.5 &#x3bc;m is less than or equal to 0.1%. An electric resistivity value of the aluminum alloy foil is more than or equal to 3.0 &#x3bc;&#x3a9;cm and less than or equal to 5.0 &#x3bc;&#x3a9;cm.

Provided is an aluminum alloy foil that has sufficient surface hardness, while exhibiting excellent moist-heat resistance and corrosion resistance. The aluminum alloy foil contains 96.9 mass % or more aluminum, 0.4 mass % or more and 3 mass % or less of manganese, 0.03 mass % or more and 0.08 mass % or less of iron, 0.00001 mass % or more and 0.1 mass % or less of silicon, 0.00001 mass % or more and 0.03 mass % or less of copper, 0.00001 mass % or more and 0.01 mass % or less of zinc, and 0.00001 mass % or more and 0.001 mass % or less of magnesium, based on the aluminum alloy foil taken as 100 mass %.

Aluminum alloy foil, laminate of same, method for producing said aluminum alloy foil, and method for producing said laminate

An aluminum foil includes a first main surface and a second main surface located opposite to the first main surface. In at least one of the first main surface and the second main surface, a surface roughness Ra is not more than 10 nm, a surface roughness Rz is not more than 40 nm in each of a rolling direction and a direction perpendicular to the rolling direction, and the number of peak counts is not less than 10 when a reference length is 40 &#x3bc;m, the number of peak counts being determined from a roughness curve in at least one of the rolling direction and the direction perpendicular to the rolling direction.

Aluminum foil, electronic device, roll-to-roll aluminum foil, and method of producing aluminum foil

Provided are an antenna circuit constituent body for an IC card/tag, which enhances a Q value by reducing a permittivity of a resin film of which a base material is made; and an IC card. The antenna circuit constituent body includes the base material made of resin film; and circuit pattern layers formed on each of both sides of the base material and made of aluminum foil. The circuit pattern layer includes a coiled pattern layer. Parts of the circuit pattern layers, which mutually face each other; and a part of the base material, which is interposed between the parts of the circuit pattern layers, constitute a capacitor. The circuit pattern layers are electrically connected by crimping parts. The base material includes a plurality of void-state-air layers. A relative density of the base material with respect to a density of a resin is less than or equal to 0.9.

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Osaka, Japan

Akira Shingu