Fanuc Corporation

Akinori Ohyama

Atsushi Mori

Junichi Tezuka

Hiroshi Takigawa

Takashi Izumi

Tetsuro Sakano

Michinori Maeda

Yuji Nishikawa

Ryusuke Miyata

Hisatada Machida

Hiroyuki Yoshida

Koji Hayano

Tatsuya Mochizuki

A laser processing device having a function for reducing intensity of a reflected laser beam, without stopping laser oscillation, in order to avoid a malfunction due to the reflected beam. A controller for controlling a laser oscillator has: a laser processing commanding part configured to output a laser processing command; a memory configured to store monitored intensity of the reflected beam and a laser output condition; a pre-processing commanding part configured to command a pre-processing prior to the laser processing command; a comparing part configured to compare the stored intensity of the reflected beam to a first judgment value and/or a second judgment value lower than the first judgment value; an output condition changing part configured to set or change the laser output command of the pre-processing command based on a comparison result; and a pre-processing terminating part configured to terminate the pre-processing based on a predetermined condition.

Laser processing device capable of reducing intensity of reflected laser beam

A machine learning apparatus that learns laser machining condition data of a laser machining system includes: a state amount observation unit that observes a state amount of the laser machining system; an operation result acquisition unit that acquires a machined result of the laser machining system; a learning unit that receives an output from the state amount observation unit and an output from the operation result acquisition unit, and learns the laser machining condition data in association with the state amount and the machined result of the laser machining system; and a decision-making unit that outputs laser machining condition data by referring to the laser machining condition data learned by the learning unit.

Machine learning apparatus, laser machining system and machine learning method

The machine learning apparatus includes: a state data observing unit which observes state data of the laser apparatus, including data output from a reflected light detecting unit for measuring a reflected light amount; an operation result acquiring unit which acquires a success/failure result indicating whether the machining has been started successfully by the laser beam output from a laser oscillator; a learning unit which learns light output command data by associating the light output command data with the state data of the laser apparatus and the success/failure result of the machining start; and a decision making unit which determines the light output command data by referring to the light output command data learned by the learning unit.

Machine learning apparatus for learning condition for starting laser machining, laser apparatus, and machine learning method

A laser processing device has a preprocessing controller which issues a command to perform preprocessing of a workpiece under high output conditions, which are previously found by an experiment or calculation in accordance with at least some of processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is melted, changed in shape, or denatured; a command to irradiate the workpiece with a laser beam under low output conditions, which are previously found by an experiment or calculation in accordance with at least some of the processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is not melted, changed in shape, or denatured; and a command of whether to start the laser processing, based on a first light quantity of light reflected or emitted from a processing point irradiated with a laser beam under the low output conditions.

Laser processing device having preprocessing controller and laser processing method

A processing information acquisition system in a processing machine which feeds a processing point energy or material, the processing information acquisition system provided with a position information acquisition unit which acquires position information of a feed unit of energy or material, a feed rate control unit which receives a feed condition command of energy or material, converts the feed condition command to a control command which controls a feed of energy or material, and uses the converted control command to control a feed rate of energy or material from the feed unit, a feed rate estimation unit which acquires the control command from the feed rate control unit and calculates an estimated feed rate of energy or material which is fed to a processing point based on the control command, and an output unit which outputs the position information which the position information acquisition unit acquired and the estimated feed rate which the feed rate estimation unit calculated when the feed unit is located at a position corresponding to the position information.

Processing information acquisition system in processing machine supplying processing point with energy or material

A two-dimensional LD (laser diode) array light-emitting device constituted by stacking light-emitting units each having a LD bar and a cooling assembly for cooling the LD bar with a simplified electrical connection structure to reduce manufacturing cost. The cooling assembly is electrically connected with one electrode of the LD bar through the die spacer so that a part of the cooling assembly serves as one electrode of the light-emitting unit. The other electrode of the LD bar is electrically connected with a webbed extending section of a conductive layer of a TAB (tape-automated bonding) sheet so that the conductive layer serves as the other electrode of the light-emitting unit. A space between the adjacent cooling assemblies for arranging the LD bar is adjusted by the spacer sheet intervened between the TAB sheet and the cooling assembly.

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Yamanashi, Japan

Akinori Ohyama