Jsr Corporation

Akimasa Soyano

Hiroshi Tomioka

Yukio Nishimura

Noboru Otsuka

Hiroyuki Ishii

Dominique Charmot

Kenji Okamoto

Adam Luke Safir

Tsutomu Shimokawa

Isao Nishimura

Han-Ting Chang

Masafumi Yamamoto

Takeshi Ishii

Yong Wang

Yusuke Asano

Toru Kajita

Kiyoshi Murata

Didier G Benoit

Motoyuki Shima

Nobuji Matsumura

Jun Numata

Norihiro Natsume

Yoshifumi Oizumi

Hiromichi Hara

Ryuichi Serizawa

Aki Suzuki

Hidemitsu Ishida

A radiation-sensitive resin composition that provides a resist coating film in a liquid immersion lithography process is provided, the radiation-sensitive resin composition being capable of exhibiting a great dynamic contact angle during exposure, whereby the surface of the resist coating film can exhibit a superior water draining property, and the radiation-sensitive resin composition being capable of leading to a significant decrease in the dynamic contact angle during development, whereby generation of development defects can be inhibited, and further shortening of a time period required for change in a dynamic contact angle is enabled. A radiation-sensitive resin composition including (A) a polymer having a structural unit (I) represented by the following formula (1), and (B) a radiation-sensitive acid generator. 

Radiation-sensitive resin composition, method for forming resist pattern, and polymer and compound

A radiation-sensitive resin composition includes a polymer and a photoacid generator. The polymer includes a first structural unit shown by a formula (a1), a second structural unit shown by a formula (a2), and a third structural unit having a lactone structure. A content of the first structural unit in the polymer being 50 mol % or more based on total structural units included in the polymer. The first structural unit is preferably a structural unit shown by a formula (a1-1). 

Radiation-sensitive resin composition

A radiation-sensitive resin composition includes a first polymer including a repeating unit represented by a following formula (I). Xis an onium cation. Xin the formula (I) is preferably an onium cation represented by a following formula (1-1), an onium cation represented by a following formula (1-2) or a combination thereof. 

Radiation-sensitive resin composition, polymer, and compound

The present invention is directed to the preparation of photoresist polymers via living free radical polymerization techniques. Sterically bulky ester monomers are utilized as the polymerization components. Use of chain transfer agents is included in polymerization processing conditions. Cleavage of polymer terminal end groups that include a heteroatom are described.

Photoresist polymer compositions

A positive-tone radiation-sensitive resin composition comprising: (A) a low molecular weight compound having at least one amino group in which the nitrogen atom has at least one hydrogen atom bonded thereto and at least one of the hydrogen atoms is replaced by a t-butoxycarbonyl group, (B) a photoacid generator, and (C-1) a resin insoluble or scarcely soluble in alkali which is protected by an acid-dissociable group and becomes soluble in alkali when the acid-dissociable group dissociates or (C-2) an alkali-soluble resin and an alkali solubility control agent is disclosed. Also disclosed is a negative-tone radiation-sensitive resin composition comprising the low molecular weight compound (A), the photoacid generator (B), an alkali-soluble resin (D), and a compound capable of crosslinking with the alkali-soluble resin in the presence of an acid(E). The composition are useful as a chemically amplified resist which effectively responds to various radiations, exhibits superior sensitivity and resolution, forms fine patterns at a high precision and in a stable manner even if the patterns are isolated line patterns.

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Tokyo, Japan

Akimasa Soyano