Tokyo Electron Limited

Akiko Kiyotomi

Tadashi Nishiyama

Kazuya Hisano

Hiroshi Tomita

Takuya Mori

Masato Hosaka

Yasuaki Noda

Masatoshi Kawakita

Shin Inoue

Keisuke Hamamoto

This method includes, in a substrate treatment system, acquiring an image of a reference substrate which is a reference for condition setting; and acquiring an image of a treated substrate on which the predetermined treatment has been performed under a first treatment condition. A deviation amount in information between the image of the treated substrate and the image of the reference substrate is calculated. A correction amount of the treatment condition is calculated based on a correlation model indicating a correlation between a change amount in the information in the image of the treated substrate and a change amount in the treatment condition and on the deviation amount in the information. Also included is a setting of a second treatment condition based on the correction amount and a performing of the treatment on a target substrate based on the set second treatment condition.

Treatment condition setting method, storage medium, and substrate treatment system

A substrate inspection apparatus includes: a storage configured to store inspection image data obtained from a captured image of a periphery of a substrate on which a film is formed, and an inspection recipe; an edge detector configured to detect a target edge as an edge of an inspection target film on the basis of the inspection image data stored in the storage by using the inspection recipe stored in the storage; a periphery calculator configured to calculate a position of a theoretical periphery of the substrate; and a width calculator configured to calculate a width between the theoretical periphery of the substrate and the target edge on the basis of position data of the theoretical periphery of the substrate obtained by the periphery calculator and position data of the target edge obtained by the edge detector.

Substrate inspection apparatus, substrate processing apparatus, substrate inspection method, and computer-readable recording medium

This method includes a step of imaging, by an imaging apparatus in a substrate treatment system, a reference substrate which is a reference for condition setting and acquiring a captured image of the reference substrate; and a step of imaging, by the imaging apparatus, a treated substrate on which the predetermined treatment has been performed under a current treatment condition and acquiring a captured image of the treated substrate. A deviation amount in color information between the captured image of the treated substrate and the captured image of the reference substrate is calculated. A correction amount of the treatment condition is calculated based on a correlation model acquired in advance and on the deviation amount in the color information. Also included is a step of setting the treatment condition based on the correction amount and performing the treatment on a target substrate based on the set treatment condition.

A coating film forming apparatus includes a carry-in/out section in which a substrate is carried in and carried out; a periphery coating module configured to form a ring-shaped coating film by supplying a coating liquid along a periphery of the substrate based on a processing parameter for controlling a coating state by the coating film; an imaging module configured to image the substrate on which the ring-shaped coating film is formed; a transfer mechanism configured to transfer the substrate; and a controller configured to output a control signal to perform a process of forming the ring-shaped coating film on the substrate based on the processing parameter having different values and imaging the substrate by the imaging module, and configured to determine, based on an imaging result of the substrate, a value of the processing parameter for forming the ring-shaped coating film on the substrate in the periphery coating module.

Coating film forming apparatus and adjustment method therefor

Defects of substrates are inspected when executing a job in which a treatment recipe for substrates and the substrates being treatment objects are designated to perform predetermined treatments on the substrates. An imaging step successively images substrates. A first determination step decomposes, in order from the substrate as head of the job, a planar distribution of pixel values in a substrate image captured at the imaging step into pixel value distribution components using a Zernike polynomial, calculates Zernike coefficients of the pixel value distribution components corresponding to defects to be detected, and determines presence or absence of a defect based on the calculated Zernike coefficients. A second determination step determines, from predetermined timing after one or more substrates is determined to have no defect at the first determination step, presence or absence of a defect based on the substrate image determined to have no defect at the first determination step.

Substrate defect inspection method, storage medium, and substrate defect inspection apparatus

A substrate inspection apparatus includes: a storage configured to store inspection image data obtained from a captured image of a periphery of a substrate on which a plurality of films is formed, and an inspection recipe; and an edge detector configured to detect a target edge as an edge of an inspection target film among the films on the basis of the inspection image data stored in the storage by using the inspection recipe stored in the storage. Each of edges of the films extends along the periphery of the substrate. The inspection recipe is configured by combining parameters each of which has one option specified among a plurality of options.

An apparatus includes: a coating module for applying a coating liquid to each wafer and discharging a removing liquid from a nozzle toward a beveled portion of the wafer under rotation; an imaging module; and a controller for controlling: the imaging module to image outer end and rear surfaces of the wafer; obtaining a height dimension of an outer edge of a coating film with respect to an inner edge of the beveled portion based on the imaging result; determining whether or not the obtained dimension is an allowable value; if the result is negative, resetting the number of revolutions of the wafer based on the obtained dimension and a first reference data; controlling the coating module to again perform the application and removal operations; performing the determination process; and if the result is positive, storing the reset number of revolutions in a storage part.

Substrate processing apparatus, method of adjusting parameters of coating module, and storage medium

A substrate inspection method includes a first process of taking, while rotating a holding table where a reference substrate is held, an image of an end surface of the reference substrate; a second process of obtaining shape data on the end surface of the reference substrate by processing the image; a third process of taking, while rotating the holding table where a target substrate is held, an image of an end surface of the target substrate; a fourth process of obtaining shape data on the end surface of the target substrate by processing the image; and a fifth process of calculating a warpage amount of the target substrate by obtaining a difference between the shape data obtained in the second process and in the fourth process under a condition that a rotational position of the holding table in the first process coincides with that in the third process.

Substrate inspection method, substrate inspection apparatus and recording medium

A substrate inspection method includes: acquiring a feature amount of each of divided areas in an inspection target peripheral edge image, the inspection target peripheral edge image being an image of a peripheral portion of a target substrate as an inspection target, the divided areas being obtained by dividing a predetermined area in the image of the peripheral portion of the target substrate into a plurality of areas; and performing a predetermined determination concerning inspection of the peripheral portion of the target substrate based on an acquisition result in the acquiring the feature amount.

Substrate inspection method and substrate inspection apparatus

A treatment solution supply apparatus that supplies a treatment solution from a treatment solution supply source via a treatment solution supply pipe to a supply nozzle, includes: electrodes that are provided at the treatment solution supply pipe and apply a DC voltage to the treatment solution in the treatment solution supply pipe; a power unit that applies the DC voltage to the electrodes while freely reversing a polarity of the DC voltage; a cleaning solution supply pipe connected to the treatment solution supply pipe and configured to supply a cleaning solution from a cleaning solution supply source to the treatment solution supply pipe; and a waste solution pipe that drains the cleaning solution passed through a position of the treatment solution supply pipe where the electrodes are provided.

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Koshi, Japan

Akiko Kiyotomi