Ebara Corporation

Akihiro Yazawa

Kenichi Kobayashi

Kenichi Akazawa

Asagi Matsugu

Takashi Mitsuya

Yasuyuki Miyasawa

Takahiro Nanjo

Hideharu Aoyama

Tsuyoshi Soma

Tetsuji Togawa

Masaya Seki

Toshio Yokoyama

Makoto Kashiwagi

Kenichiro Saito

Manao Hoshina

Akira Owatari

Masanori Sasaki

Naoki Dai

Hiroyuki Takenaka

Fong-Jie Du

Manato Furusawa

Ayumu Saito

Yusuke Sasaya

Keiichi Nojo

Takashi Koba

To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure. A cleaning module includes a first transfer mechanism-, an ultrasonic cleaning tank, a transfer machine, and a second transfer mechanism-. The first transfer mechanism-is for transferring a substrate WF with a surface to be polished facing downward up to a substrate grip or release positionon a downstream side along a transfer passage. The ultrasonic cleaning tankis disposed at a position spaced apart from the transfer passageand is for cleaning a substrate WF with the surface to be polished facing downward. The transfer machineis for transferring the substrate WF between the substrate grip or release positionof the transfer passageand the ultrasonic cleaning tank. The second transfer mechanism-is for transferring the substrate WF transferred to the substrate grip or release positionfrom the ultrasonic cleaning tankby the transfer machineto further downstream along the transfer passage

Transfer apparatus, cleaning module, and substrate processing apparatus

To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.

Substrate transporter and substrate processing apparatus including substrate transporter

An accuracy of detecting a slip out of a substrate from a top ring is improved. A polishing unitincludes a polishing table, a top ring, a light emitting member, a slip-out detector, and an elimination mechanism. A polishing padthat polishes a substrate WF is attached to the polishing table. The top ringholds the substrate WF to press the substrate WF against the polishing pad. The light emitting memberemits a light to a detection areaon the polishing pad. The slip-out detectordetects a slip out of the substrate WF from the top ringbased on the light reflected from the detection area. The elimination mechanismeliminates a polishing liquid flowing into the detection area

Polishing unit, substrate processing apparatus, and polishing method

According to the present disclosure, there is provided a substrate holding module that is capable of accommodating a substrate transferred by a transfer robot. The substrate holding module includes a pedestal including a holding mechanism configured to hold the substrate, a cover configured to cover the pedestal, and a moving mechanism configured to move the cover away from the pedestal.

Substrate holding module, substrate processing apparatus, and substrate processing method

Disclosed is a reversing machine that reverses a substrate upside down. The reversing machine includes: a first arm pair configured to mount a substrate thereon; a second arm pair facing the first arm pair; an opening/closing mechanism configured to open/close the second arm pair so as to grip the substrate mounted on the first arm pair; and a rotating mechanism configured to rotate the first arm pair and the second arm pair around a predetermined axis that is set inside the first arm pair and the second arm pair and extends along an extension direction of the first arm pair and the second arm pair such that the substrate is reversed upside down.

Reversing machine and substrate polishing apparatus

A plating apparatus enabling a user to conduct maintenance of a substrate holder while an operation of the plating apparatus is being performed is disclosed. The plating apparatus includes: a processing section for plating a substrate; a storage container configured to store the substrate holder for holding the substrate; a transport machine configured to transport the substrate holder between the processing section and the storage container; a maintenance area adjacent to the storage container; and a substrate-holder carrier supported by the storage container. The substrate-holder carrier is movable between the storage container and the maintenance area while supporting the substrate holder.

Plating apparatus

Disclosed is a substrate transfer apparatus including: a pair of hands facing with each other; an opening/closing mechanism configured to move the pair of hands symmetrically in an opening/closing direction; a driving unit configured to transmit a power to the opening/closing mechanism; and a controller configured to control an operation of the driving unit. The opening/closing mechanism includes: a rotating body configured to rotate depending on a moving amount of the pair of hands in the opening/closing direction, and a sensor configured to detect a rotating amount of the rotating body. The controller controls an operation of the driving unit based on a signal from the sensor.

Substrate transfer apparatus and substrate transfer method

An object of the invention is to provide a calibration apparatus which enables the pressing force of the polishing pad to be adjusted by a simple method without the need of removing a stage on which a substrate can be placed. One embodiment of the invention provides a calibration apparatus for a bevel polishing system for polishing a bevel portion of a substrate, comprising: a load measuring device capable of measuring a pressing load from a polishing pad of the bevel polishing system; and a base plate capable of having the load measuring device placed thereon, wherein the base plate is capable of being fixed on a vacuum suction table which is capable of having a substrate placed thereon.

Calibration apparatus and calibration method

A polishing apparatus detects the escape of a substrate from a top ring during polishing. The polishing apparatus includes a polishing table having a polishing pad, a top ring, and a substrate escape detection section for detecting escape of the substrate from the top ring. The detection section includes a light irradiation member for irradiating an area of the upper surface of the polishing pad with light, a controller for controlling the light irradiation of the light irradiation member, an image-taking member for taking an image of the area irradiated with the light, and an information processing member for processing information outputted from the image-taking member. The controller controls the light irradiation member in such a manner that it performs light irradiation at least for a period of time during which the substrate is regarded as being in contact with the polishing pad.

Polishing apparatus and substrate processing method

A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The substrate processing apparatus includes a loading/unloading and cleaning area accommodating a first transfer robot which has a hand adapted for handling a dry substrate and a hand adapted for handling a wet substrate, a loading port which loads a substrate cassette that houses a substrate, and a cleaning unit for cleaning a substrate. A plating treatment area accommodates a second transfer robot which has a back surface-attracting type of hand provided with a reversing mechanism, a pretreatment unit for carrying out pretreatment of a substrate before plating, and a plating treatment unit for carrying out plating treatment of the substrate.

Growing community of inventors

Tokyo, Japan

Akihiro Yazawa