Mitsubishi Rayon Company, Limited

Micro Process Inc.

Everlight Chemical Industrial Corporation

Akifumi Ueda

Hikaru Momose

Tadayuki Fujiwara

Atsushi Ootake

Takeshi Iwai

Masaru Takeshita

Kenji Kushi

Ryotaro Hayashi

Tadashi Nakamura

Takayuki Iseki

Kazuhiko Jufuku

Shigeki Watanabe

Hidetaka Nakagawara

Kazuo Watanabe

Wei Jen Lan

Chao Wen Lin

Hitoshi Iwasaki

Saki Fujita

Youichi Nagai

Shintaro Okada

The photosensitive resin composition of the present invention contains a vinyl-based (co)polymer (I) obtained by polymerizing a monomer mixture (&#x3b1;) containing a vinyl-based monomer (a) having a phenolic hydroxyl group, a vinyl-based copolymer (II) having a weight-average molecular weight of 15,000 to 120,000, obtained by polymerizing a monomer mixture (&#x3b2;) containing a vinyl-based monomer (b) represented by CH&#x2550;CRCOO(RO)R(wherein R=a hydrogen atom or a methyl group, R=a hydrocarbon group having a carbon number of 1 to 4, R=a hydrogen atom or a methyl group, and k=1 to 90) and a carboxyl group-containing vinyl-based monomer (c), a photosensitive substance (III), and a compound (IV) which is a specific aromatic polyhydroxy compound.

Photosensitive resin composition, photosensitive dry film, pattern formation method, printed circuit board, and method for producing same

A resist polymer (Y'), which is used as a resist resin in DUV excimer laser lithography, electron beam lithography, and the like, contains a polymer (Y) comprising: a constituent unit (A) having a lactone skeleton; a constituent unit (B) having an acid-eliminable group; a constituent unit (C) having a hydrophilic group; and a constituent unit (E) having a structure represented by formula (1), wherein a content of the constituent unit (E) is 0.3 mol % or more based on the total number of the constituent units of the resist polymer (Y&#x2032;): 

Resist polymer, process for production thereof, resist composition, and process for production of substrates with patterns thereon

The present invention is related to a photosensitive resin composition containing: a vinyl-based copolymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group and a carboxyl group-containing vinyl monomer (b); a quinonediazide compound (II) and a compound (III) represented by the following formula (5), and to a photosensitive dry film and a method for forming a patter by using the photosensitive resin composition. According to the present invention, it is possible to provide a photosensitive resin composition which can form a resist film in which the occurrence of crack is suppressed, the film reduction of the unexposed area is suppressed, and sensitivity and resolution are excellent, and to provide a photosensitive dry film and a method for forming a pattern by using the photosensitive resist composition  [In the formula, Y is a straight or branched hydrocarbon group of 1 to 6 carbon atoms; 1 and m are respectively independently an integer of 1 to 3; n is 1 or 2; p and q are respectively independently 0 or 1.]

Photosensitive resin composition, photosensitive dry film and method for forming pattern

A photosensitive resin composition comprising: a vinyl-based polymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group; a vinyl-based polymer (II) obtained by polymerizing a monomer mixture containing a carboxyl group-containing vinyl monomer (b), and having a weight average molecular weight of 20,000 to 100,000, provided that the vinyl-based polymer (I) is excluded; a quinonediazide compound (III); and a compound (IV) represented by following formula (5). [In the formula, Y is a hydrocarbon group of 1 to 6 carbon atoms; l and m are each independently an integer of 1 to 3; n is 1 or 2; p and q are each independently 0 or 1.]. 

To provide a resist polymer comprising, as a structural unit, an acid-decomposable unit having a structure represented by formula (1) or (2) which exhibits a small line edge roughness and produces little defects in DUV excimer laser lithography or the like.  In formulas (1) and (2), n represents an integer of 2 to 24; J represents a single bond or a divalent hydrocarbon group which may have a substituent/heteroatom when n=2, or represents an n-valent hydrocarbon group which may have a substituent/heteroatom when n&#x2267;3; E represents a residue of a polymerization terminator, a chain transfer agent or a polymerization initiator; Kand Keach represent at least one selected from alkylene, cycloalkylene, oxyalkylene, arylene, a divalent thiazoline ring, a divalent oxazoline ring and a divalent imidazoline ring; Land Leach represent at least one selected from &#x2014;C(O)O&#x2014;, &#x2014;C(O)&#x2014; and &#x2014;OC(O)&#x2014;; M, Mand Meach represent at least one selected from alkylene, cycloalkylene, oxyalkylene and arylene; Y, Yand Yeach represent an acid-decomposable linkage; k1, k2, l1, l2, m1, m2, and m3 each represent 0 or 1; and Rrepresents H or a methyl group.

Resist polymer, resist composition, process for pattern formation, and starting compounds for production of the resist polymer

The resist polymer of the present invention comprises a specific constitutional unit having a cyano group, a constitutional unit having an acid-dissociable group, and a specific constitutional unit having a lactone skeleton. When the above polymer is used as a resist resin in DUV excimer laser lithography or electron beam lithography, it exhibits high sensitivity and high resolution, and provides a good resist pattern shape, having a small degree of occurrence of line edge roughness or generation of microgels.

Resist polymer and resist composition

A resist polymer (Y'), which is used as a resist resin in DUV excimer laser lithography, electron beam lithography, and the like, contains a polymer (Y) comprising: a constituent unit (A) having a lactone skeleton; a constituent unit (B) having an acid-eliminable group; a constituent unit (C) having a hydrophilic group; and a constituent unit (E) having a structure represented by the following formula (1), wherein a content of the constituent unit (E) is 0.3 mol % or more based on the total number of the constituent units of the resist polymer (Y&#x2032;): 

Resist polymer, process for production thereof, resist composition, and process for production of substrated with patterns thereon

To provide a resist polymer comprising, as a structural unit, an acid-decomposable unit having a structure represented by formula (1) or (2) which exhibits a small line edge roughness and produces little defects in DUV excimer laser lithography or the like. In formulas (1) and (2), n represents an integer of 2 to 24; J represents a single bond or a divalent hydrocarbon group which may have a substituent/heteroatom when n=2, or represents an n-valent hydrocarbon group which may have a substituent/heteroatom when n&#x2267;3; E represents a residue of a polymerization terminator, a chain transfer agent or a polymerization initiator; Kand Keach represent at least one selected from alkylene, cycloalkylene, oxyalkylene, arylene, a divalent thiazoline ring, a divalent oxazoline ring and a divalent imidazoline ring; Land Leach represent at least one selected from &#x2014;C(O)O&#x2014;, &#x2014;C(O)&#x2014; and &#x2014;OC(O)&#x2014;; M, Mand Meach represent at least one selected from alkylene, cycloalkylene, oxyalkylene and arylene; Y, Yand Yeach represent an acid-decomposable linkage; k1, k2, l1, l2, m1, m2, m3 and n1 each represent 0 or 1; and Rrepresents H or a methyl group.

A polyester resin for a dye receptive layer of a recording medium for sublimation type heat-sensitive transfer recording process, and a recording medium using thereof, which has superior resistance to light exposure and dark fade out. A polyester resin for a dye receptive layer of a recording medium for sublimation type heat-sensitive transfer recording process, wherein said polyester resin is formed by using a diol component containing a diol compound shown in Formula (1) in a range of 5-80 molar % with respect to the total diol component, and a receiving medium using thereof. ##STR1## (In Formula (1), each of R.sub.1 and R.sub.2 represents an alkylene group having a number of carbon atoms within a range of 1-12.)

Polyester resin for a dye receptive layer of a recording medium for

A recording medium for sublimation type heat-sensitive transfer recording process, in which an image receiving layer comprising a resin composition containing a dyeable resin and at least one phosphite antioxidant shown in Formulas (1), (2), or (3) is formed on a substrate surface. This recording medium for sublimation type heat-sensitive recording methods has extremely superior light resistance, and the image recorded on this recording medium suffers little fade out or discoloration as a result of exposure to light, so that this recording medium is expected to contribute greatly to the spread of video printers and the like. ##STR1## (In Formula (1), R.sub.1 and R.sub.2 represent H or an alkyl group having a number of carbon atoms within a range of 1-20, R.sub.3 and R.sub.4 represent alkyl groups having a number of carbon atoms within a range of 1-20, X represents H or an atomic group having 1-10 carbon atoms as a main skeleton thereof, and n has a value of 1, 2, 3, or 4.) ##STR2## (In Formula (2), R.sub.5 and R.sub.6 represent H or an alkyl group having a number of carbon atoms within a range of 1-20, R.sub.7 represents an alkyl group having a number of carbon atoms within a range of 1-20, Y represents H or an atomic group having 1-10 carbon atoms as a main skeleton thereof, and n has a value of 1, 2, 3, or 4.) ##STR3## (In Formula (3), RS, R.sub.9, R.sub.10, and R.sub.11 represent H or an alkyl group having a number of carbon atoms within a range of 1-20, Z represents H or an atomic group having 1-10 carbon atoms as a main skeleton thereof, and n has a value of 1, 2, 3, or 4.)

Recording medium for sublimation type heat-sensitive transfer recording

A recording medium for sublimation type heat-sensitive transfer recording process is disclosed in which an image receiving layer constituting a resin composition containing a dyeable resin and at least one compound shown in Formula (1) is formed on a substrate surface. This recording medium for sublimation type heat-sensitive transfer recording process has extremely superior light resistance, and the image recorded on this recording medium suffers little fade out or discoloration as a result of exposure to light, so that this recording medium is expected to contribute greatly to the spread of video printers and the like. ##STR1## (In Formula (1), R.sub.1 represents an alkyl group having a number of carbon atoms within a range of 1-20, and A represents a substituted or unsubstituted phenylene group or naphthalene group.)

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Yokohama, Japan

Akifumi Ueda