Lam Research Corporation

Afshin Nickhou

John Boyd

Michael Ravkin

James Paul Garcia

John Martin De Larios

Fritz C Redeker

Mike Ravkin

Carl Woods

Katrina Mikhaylichenko

John M deLarios

Randolph E Treur

One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously.

Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces

A megasonic module for substrate processing is provided. Embodiments of the present invention include a tank configured to hold processing fluids in which the substrate is submerged, and a lid configured to mate with and seal the tank. At least two megasonic transducers are positioned within the megasonic module to direct megasonic energy to each of an active surface and a backside surface of the substrate. A pair of drive wheels are configured to receive an edge of the substrate to support and rotate the substrate in a horizontal orientation between the at least two megasonic transducers. The substrate is supported against the pair of drive wheels by a substrate stabilizing arm/wheel which also allows the rotation of the substrate. A drive motor is configured to rotate the pair of drive wheels, and a fluid recirculation system provides for temperature control and use of a plurality of processing fluids.

Megasonic substrate processing module

A system and method for re-circulating processing fluids in a substrate processing system is provided. A fluid re-circulation system for a brush box processing tool includes a supply tank into which processing chemicals, DI water, or other processing fluids are introduced into the system from an external source. Processing chemicals are provided to the brush box and dispensed to process a substrate. Dispensed fluids drain from the brush box into a diverter through which fluids either flow to waste, or into a collection tank. Fluids from the collection tank flow into the supply tank to re-circulate for wafer processing. The re-circulation system includes filters for maintaining chemical purity, and chemical concentration is monitored and adjusted as necessary.

Substrate processing using a fluid re-circulation system in a wafer scrubbing system

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Campbell, CA, United States of America

Afshin Nickhou