Kla Corporation

Adi Pahima

Shai Mark

Yoram Uziel

Giampietro Bieli

Mor Azaria

Avner Safrani

Ron Rudoi

A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on a bottom side of the substrate. One or more structures within the one or more patterns attract one or more particles from a chuck via at least one of electrostatic attraction or mechanical trapping when the substrate is positioned on the chuck.

In-situ process chamber chuck cleaning by cleaning substrate

A substrate cleaning system include a chamber and a substrate stage positioned within the chamber. The substrate stage is configured to secure a substrate for cleaning with a cleaning head. The substrate cleaning system includes a robot configured to transfer the substrate between a storage receptable and the substrate stage. The cleaning head includes a disposable electrode ribbon loaded on a roller assembly. The disposable electrode ribbon includes a positive electrode and a negative electrode and is configured to electrostatically clean the substrate by electrostatically removing particles from the substrate. The roller assembly is configured to advance the disposable electrode ribbon following cleaning of the substrate.

Electrostatic substrate cleaning system and method

A reticle inspection system and a method of handling a reticle in a reticle inspection system are provided. The reticle inspection system includes an active reticle carrier and an inspection tool. The reticle is disposed on the active reticle carrier, and the inspection tool is configured to determine an orientation of the reticle when the active reticle carrier is disposed on a reticle stage. The active reticle carrier is movable between a loading station and the reticle stage and is configured to rotate the reticle to reorient the reticle based on the orientation of the reticle while the active carrier is disposed on the reticle stage.

Active reticle carrier for in situ stage correction

In situ process chamber chuck cleaning by cleaning substrate

A cleaning assembly may include a chuck. The cleaning assembly may include a plurality of lift pins positioned proximate to the chuck. The plurality of lift pins may be configured to engage a cleaning substrate and translate the cleaning substrate to allow the cleaning substrate to capture one or more particles from the surface of the chuck via at least one of electrostatic attraction or mechanical trapping when the cleaning substrate is positioned in the second position. The cleaning assembly may include a replaceable top skin coupled to the chuck and configured to capture the one or more particles.

Growing community of inventors

Migdal Haemek, Israel

Adi Pahima