Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Adam Makosiej

Olivier Thomas

Costin Anghel

Bastien Giraud

Amara Amara

Navneet Gupta

David Coriat

Pablo Royer

Cyrille Le Royer

Jean-Philippe Noel

Jean-Michel Portal

Santhosh Onkaraiah

Thomas-Medhi Benoist

Haithem Ayari

Yves Maneglia

Andrei Vladimirescu

A 3D microelectronic device is provided with several superimposed layers of components, with an upper layer including one or several memory cells having a SRAM structure and provided with a rear biasing electrode. The biasing of the rear biasing electrode is modified to switch the memory cells from a ROM operating mode to a SRAM operating mode.

3D SRAM/ROM with several superimposed layers and reconfigurable by transistor rear biasing

A memory circuit including a plurality of elementary cells arranged in a plurality of arrays, each including a plurality of rows and a plurality of columns, and wherein: the elementary cells having the same coordinates in the different arrays share a same first conductive track; and in each array, the elementary cells of a same row of the array share a same second conductive track and a same third conductive track.

Memory circuit

Memory device provided with a set of memory cells having a first inverter and a second inverter each connected to a supply line from a first supply line and a second supply line, the memory device being provided with a circuit element configured for:

SRAM/ROM memory reconfigurable by supply connections

Memory circuit for implementing logic operations and provided with memory cells, in particular of structure 6T, with a control circuit configured to activate the first access transistors or the second access transistors of at least two cells of the same given column and for detecting from a low- or high-voltage power supply line, from said given column, separate from the bit lines, a signal representative of the result of a logic operation having for operands data stored in said at least two cells.

In memory computing (IMC) memory circuit having 6T cells

Circuit for triggering the end of a read operation, for a SRAM memory device, comprising:

SRAM memory with improved end-of-read triggering

A PVT detection circuit including: first and second transistors of a first conduction type each having its control node coupled to a control line, the first and second transistors being configured such that the variations in their threshold voltages as a function of temperature and/or process are different from each other; and an amplifier coupled to a second main conducting node of each of the first and second transistors and configured to amplify a difference in the currents conducted by the first and second transistors in order to generate an output signal.

PVT detection circuit

Tri-state inverter includes a n-TFET and a p-TFET, the drain of the n-TFET being connected to the drain of the p-TFET and to an output of the tri-state inverter, the gates of the n-TFET and p-TFET being connected to an input of the tri-state inverter, and a control circuit able to apply a first control voltage on the source of the n-TFET and a second control voltage on the source of the p-TFET, the values of the first and second control voltages being positive or zero, wherein, when the tri-state inverter is intended to work as an inverter, the value of the first control voltage is lower than the value of the second control voltage, and when the tri-state inverter is intended to be tri-stated, the value of the first control voltage is higher than the value of the second control voltage.

Tri-state inverter, D latch and master-slave flip-flop comprising TFETs

A SRAM memory bit cell is provided that includes a n-TFET and a p-TFET; a storage node formed by the connection of a first electrode of the n-TFET to a first electrode of the p-TFET (drains or sources); and a control circuit able to apply supply voltages on second electrodes of the n-TFET and p-TFET (sources or drains). The control circuit is configured to provide, during a retention mode, supply and bias voltages reverse biasing the n-TFET and p-TFET in a state wherein a conduction current is obtained by band-to-band tunneling in the n-TFET and p TFET. The control circuit is further configured to provide, during a writing of a bit, supply and bias voltages forward biasing the n-TFET and p-TFET and such that one of the n-TFET and p-TFET is in OFF state and that the other of the n-TFET and p-TFET is in ON state.

SRAM memory bit cell comprising n-TFET and p-TFET

Memory cell of the SRAM type, including storage transistors forming a memory point for storing a bit and a read port having at least one MOS transistor, a TFET transistor, a power terminal and a read bit line whereof a potential is designed to vary depending on the value of the stored bit, and such that:

Memory cell with read transistors of the TFET and MOSFET type to reduce leakage current

A content addressable memory having at least one CAM cell including first and second inverters cross-coupled between first and second storage nodes; a first transistor coupling the first storage node to a bitline, the first transistor being controlled by a first control signal; a second transistor coupling the second storage node to the bitline, the second transistor being controlled by a second control signal; and a control circuit adapted to perform a CAM read operation by pre-charging the bitline to a first voltage level, and then selectively activating either the first or second transistor based on a bit of input data.

Reconfigurable cam

A memory device includes a matrix of several columns of SRAM memory cells each including transistors forming a memory point, a read port and a write port, and such that the transistors of the read port and/or the P-type transistors include a second well with a conductivity type opposite that of a first well of the other transistors. The memory device also includes a polarization unit for the second wells, able to select and apply polarization potentials on the second wells, including a memory circuit of the polarization states of the second wells for each column or group of columns and a selection circuit applying a polarization potential on the second wells according to one of the values received as input, as a function of the stored polarization state associated with the column or group of columns.

Device with SRAM memory cells including means for polarizing wells of memory cell transistors

A non-volatile memory including a plurality of elementary cells, each cell including: a first programmable-resistance storage element connected between first and second nodes of the cell; a first access transistor coupling the second node to a third node of the cell; and a second access transistor coupling the second node to a fourth node of the cell.

Programmable-resistance non-volatile memory

A tunnel effect transistor includes a channel made of an intrinsic semiconductor material; source and drain extension regions on either side of the channel, the source extension region being made of a semiconductor material doped according to a first type of doping P or N and the drain extension region being made of a semiconductor material doped according to a second type of doping opposite to said first type of doping; source and drain conductive regions respectively in contact with the source and drain extension regions; a gate structure including a gate dielectric layer in contact with the channel and a gate area arranged such that the gate dielectric layer is arranged between the gate area and the channel; and an area doped according to the first type of doping inserted between the channel and the drain extension region.

Tunnel effect transistor

CMOS integrated circuits with very low consumption when idle, and notably the SRAM volatile memories, are provided. The inverters of the circuit are made up of an NMOS transistor and a PMOS transistor. A bias circuit applies a first rear bias voltage NBIAS to the wells of the NMOS transistors and a second rear bias voltage PBIAS to the wells of the PMOS transistors. The bias circuit comprises: a detection array made up of many inverters in parallel, having a common output supplying a logic signal whose value depends on the rear bias voltages applied to the array, a circuit for producing incrementation or decrementation pulses, controlled by the output of the detection array, and an integration circuit linked to the pulse-producing circuit, for producing and varying, progressively by increments in response to these pulses, a bias voltage PBIAS and a bias voltage NBIAS.

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Grenoble, France

Adam Makosiej