The University of Texas System

Versum Materials Us, LLC

Aaron Michael Dangerfield

Xinjian Lei

Moo-Sung Kim

Anupama Mallikarjunan

Yves Jean Chabal

Luis Fabián Peña

Moo-sung Kim

Luis Fabián PEÑA

Described herein are methods for forming a conformal Group 4, 5, 6, 13 metal or metalloid doped silicon nitride film. In one aspect, there is provided a method of forming an aluminum silicon nitride film comprising the steps of: providing a substrate in a reactor; introducing into the reactor an at least one aluminum precursor which reacts on at least a portion of the surface of the substrate to provide a chemisorbed layer; purging the reactor with a purge gas; introducing into the reactor an organoaminosilane precursors to react on at least a portion of the surface of the substrate to provide a chemisorbed layer; introducing a nitrogen source and an inert gas into the reactor to react with at least a portion of the chemisorbed layer; and optionally purge the reactor with an inert gas; and wherein the steps are repeated until a desired thickness of the aluminum nitride film is obtained.

Methods for depositing a conformal metal or metalloid silicon nitride film

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Plano, TX, United States of America

Aaron Michael Dangerfield