Centurion+ Patent Holders as of May 14, 2024

Anil K Nalagatla

Senior Engineering Fellow at Ethicon Endo-Surgery, Inc.

Patent №: 11980363 (May 14, 2024) – Row-to-row staple array variations. A surgical stapling assembly includes a cartridge body with cavities forming a pattern of openings on its deck, featuring longitudinally-repeating clusters. Fasteners are positioned in these cavities. The openings on one side of the cartridge body have inner openings parallel to the longitudinal axis, outer openings at an oblique angle, and intermediate openings at a different oblique angle. The assembly also includes a sled with offset ramps and/or an anvil with forming pockets near the tissue stop.

Nag B Patibandla

Vice President at Applied Materials.

At Applied Materials, Lead and direct interdivisional teams to develop processes and tools for use in manufacturing of semiconductors, GaN LEDs, power devices, and additive manufacturing (/3D Printing). Responsibilities include managing product development, business strategy, customer engagement, budget and resources management.

Patent №: 11980992 (May 14, 2024) – Integrated abrasive polishing pads and manufacturing methods.
Embodiments relate to integrated abrasive (IA) polishing pads and methods of manufacturing these pads using surface functionalized abrasive particles in additive manufacturing, such as 3D inkjet printing. A method involves dispensing and curing droplets of a first precursor to form a sub-polishing element layer. Next, droplets of both the first and a second precursor are dispensed and cured to form another layer comprising the sub-polishing element and polishing elements. The second precursor contains functionalized abrasive particles with a polymerizable group chemically bonded to their surfaces.

Haifeng Wang

CTO of Baidu, Head of AI Group and Baidu Research at Baidu, Inc.

Patent №: 11983086 (May 14, 2024) – Method for processing data, and electronic device, storage medium and program product. One method involves dispensing and curing droplets of a first precursor to form a sub-polishing element layer, then dispensing and curing a mix of first and second precursors to create a second layer with sub-polishing and polishing elements. The second precursor contains functionalized abrasive particles with polymerizable groups bonded to their surfaces.

Joseph Yudovsky

Experience in development of the highly innovative solutions for semiconductor manufacturing equipment, and complex mechanical systems in general. Broad knowledge of the mechanical components for machines, and manufacturing processes. Extensive experience in managing of the multifunctional teams.

Patent №: 11984343 (May 14, 2024) – Apparatus and methods for semiconductor processing. Described are apparatus and methods for processing a semiconductor wafer that ensure it remains in place. A pressure differential is applied between the top and bottom surfaces by reducing pressure on the back side, preventing the wafer from moving during processing.