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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US RE50869 B1

PDFFull Text
Date of Patent:
Apr. 14, 2026

Filed:

Mar. 23, 2023

Three dimensional semiconductor memory including pillars having joint portions between columnar sections

Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Hideto Takekida, Nagoya, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Leonardo Andujar

Int. Cl.
CPC ...
H01L 27/11582 (2017.01); G11C 16/04 (2006.01); G11C 16/28 (2006.01); H01L 23/00 (2006.01); H01L 27/1157 (2017.01); H01L 29/792 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/00 (2013.01); G11C 16/0483 (2013.01); G11C 16/28 (2013.01); H01L 23/58 (2013.01);
Abstract

According to one embodiment, a semiconductor memory includes a plurality of conductors stacked with insulators being interposed therebetween and a pillar through the plurality of conductors. The pillar includes a first columnar section, a second columnar section, and a joint portion between the first columnar section and the second columnar section. The pillar comprises portions that cross the respective conductors and that each function as part of a transistor. The plurality of conductors include a first conductor. The first conductor is closest to the joint portion among the plurality of conductors through the second columnar section, and includes a bending portion formed along the joint portion.

Find Patent Forward Citations

Takekida, Hideto. (2026). Three dimensional semiconductor memory including pillars having joint portions between columnar sections (U.S. Patent No. RE50869). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/RE50869

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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