The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Nov. 20, 2018
Applicant:

Sony Group Corporation, Tokyo, JP;

Inventor:

Yasushi Tateshita, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 21/28 (2006.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 30/69 (2025.01); H10D 62/00 (2025.01); H10D 64/01 (2025.01); H10D 30/60 (2025.01);
U.S. Cl.
CPC ...
H10D 30/795 (2025.01); H01L 21/28123 (2013.01); H10D 30/0273 (2025.01); H10D 30/6211 (2025.01); H10D 30/6212 (2025.01); H10D 30/792 (2025.01); H10D 30/797 (2025.01); H10D 62/021 (2025.01); H10D 64/015 (2025.01); H10D 64/017 (2025.01); H01L 21/28079 (2013.01); H01L 21/28088 (2013.01); H01L 21/28194 (2013.01); H10D 30/601 (2025.01);
Abstract

In the present invention, there is provided a semiconductor device including: element isolation regions formed in a state of being buried in a semiconductor substrate such that an element formation region of the semiconductor substrate is interposed between the element isolation regions; a gate electrode formed on the element formation region with an gate insulating film interposed between the gate electrode and the element formation region, the gate electrode being formed so as to cross the element formation region; and source-drain regions formed in the element formation region on both sides of the gate electrode, wherein a channel region made of the element formation region under the gate electrode is formed so as to project from the element isolation regions, and the source-drain regions are formed to a position deeper than surfaces of the element isolation regions.


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