The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Nov. 17, 2021
Sumitomo Electric Industries, Ltd., Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Koka, JP;
Shingo Kaimori, Osaka, JP;
Masaaki Yamauchi, Osaka, JP;
Kentaro Okamoto, Osaka, JP;
Satoshi Kiya, Koka, JP;
Kazuo Murata, Koka, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka, JP;
Abstract
A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.