The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2022

Filed:

Jan. 04, 2018
Applicants:

Epistar Corporation, Hsinchu, TW;

Interlight Optotech Corporation, Yangmei, TW;

Inventors:

Hong-Zhi Liu, Yangmei, TW;

Tzu-Chi Cheng, Yangmei, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2009.12); H01L 33/50 (2009.12); H01L 25/075 (2005.12); F21K 99/00 (2015.12); F21V 3/00 (2014.12); F21K 9/232 (2015.12); F21Y 109/00 (2015.12); F21Y 115/10 (2015.12); F21Y 107/70 (2015.12);
U.S. Cl.
CPC ...
H01L 33/504 (2012.12); F21K 9/232 (2016.07); F21V 3/00 (2012.12); F21Y 2107/70 (2016.07); F21Y 2109/00 (2016.07); F21Y 2115/10 (2016.07); H01L 25/0753 (2012.12); H01L 33/62 (2012.12); H01L 2924/0002 (2012.12);
Abstract

LED assemblies and related LED light bulbs. An LED assembly has a flexible, transparent substrate, an LED chip on the first surface and electrically connected to two adjacent conductive sections, a first wavelength conversion layer, formed on the first surface to substantially cover the LED chip, and a second wavelength conversion layer formed on the second surface. The flexible, transparent substrate has first and second surfaces opposite to each other, and several conductive sections, which are separately formed on the first surface.


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