The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2021
Filed:
May. 21, 2018
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventor:
Bo Geun Park, Gwangju, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2009.12); H01L 33/54 (2009.12); H01L 33/60 (2009.12); H01L 33/64 (2009.12); H01L 33/48 (2009.12);
U.S. Cl.
CPC ...
H01L 33/54 (2012.12); H01L 33/60 (2012.12); H01L 33/641 (2012.12); H01L 33/486 (2012.12); H01L 2924/0002 (2012.12);
Abstract
Provided is a package of a light emitting diode. The package according to an embodiment includes a base layer, a light emitting diode chip on the base layer, a lead frame electrically connected to the light emitting diode chip, a reflective coating layer directly on the lead frame, and a molding material covering the light emitting diode chip in a predetermined shape.
Park, Bo. (2021). Package of light emitting diode and method for manufacturing the same (U.S. Patent No. RE48617). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/RE48617
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile