The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2021

Filed:

Mar. 27, 2018
Applicant:

Imberatek, Llc, Herndon, VA (US);

Inventors:

Antti Kivikero, Lahela, FI;

Pekka Kostensalo, Lahti, FI;

Jaakko Hekki Tapie Moisala, Munich, DE;

Assignee:

IMBERATEK, LLC, Herndon, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2005.12); H01L 23/31 (2005.12); H01L 23/538 (2005.12); H01L 23/552 (2005.12); H01L 21/48 (2005.12); H05K 1/18 (2005.12);
U.S. Cl.
CPC ...
H01L 24/19 (2012.12); H01L 24/20 (2012.12); H01L 23/3114 (2012.12); H01L 23/552 (2012.12); H01L 24/31 (2012.12); H01L 24/83 (2012.12); H01L 2224/04105 (2012.12); H01L 2224/20 (2012.12); H01L 2924/01024 (2012.12); H01L 2924/0132 (2012.12); H01L 2924/01033 (2012.12); H01L 2924/01058 (2012.12); H01L 2924/19042 (2012.12); H01L 2924/3025 (2012.12);
Abstract

Disclosed is an electronic module with high routing efficiency and other new possibilities in conductor design. The electronic module comprises a wiring layer (), a component () having a surface with contact terminals () and first contact elements () that connect at least some of the contact terminals () to the wiring layer (). The electronic module is provided with at least one conducting pattern () on the surface of the component () but spaced apart from the contact terminals (). The electronic module further comprises a dielectric () and at least one second contact element () that connects the conducting pattern () to the wiring layer () through a portion of said dielectric (). Methods of manufacturing such modules are also disclosed.


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