The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2020
Filed:
Jun. 12, 2018
Applicants:
Juha Maijala, Kellokoski, FI;
Petri Sirviö, Imatra, FI;
Inventors:
Juha Maijala, Kellokoski, FI;
Petri Sirviö, Imatra, FI;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2005.12); B23K 1/00 (2005.12); H05K 1/00 (2005.12); H05K 3/32 (2005.12); H05K 3/34 (2005.12); H05K 13/04 (2005.12); H05K 3/12 (2005.12);
U.S. Cl.
CPC ...
H05K 3/30 (2012.12); B23K 1/0016 (2012.12); H05K 3/323 (2012.12); H05K 3/3494 (2012.12); H05K 13/0465 (2012.12); H01L 2224/16225 (2012.12); H01L 2224/75 (2012.12); H01L 2224/81 (2012.12); H05K 3/1266 (2012.12); H05K 3/3436 (2012.12); H05K 2203/0278 (2012.12); H05K 2203/111 (2012.12); Y10T 29/4913 (2015.01); Y10T 29/53178 (2015.01);
Abstract
A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.