The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2020
Filed:
Dec. 11, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Reinhold Bayerer, Warstein, DE;
Assignee:
Infineon Technologies AG, , DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2005.12); H01L 23/00 (2005.12);
U.S. Cl.
CPC ...
H01L 24/85 (2012.12); H01L 23/48 (2012.12); H01L 24/06 (2012.12); H01L 24/48 (2012.12); H01L 2224/04042 (2012.12); H01L 2224/05553 (2012.12); H01L 2224/4847 (2012.12); H01L 2224/85206 (2012.12); H01L 2924/00014 (2012.12); H01L 2924/1305 (2012.12);
Abstract
The semiconductor component has several regularly arranged active cells (), each comprising at least one main defining line (). A bonding wire () is fixed to at least one bonding surface () by bonding with a bonding tool, oscillating in a main oscillation direction (), for external electrical contacting. The bonding surfaces () are of such a size and oriented such that the main oscillation direction () runs at an angle (α), with a difference of 90° to the main defining line ().