The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2019

Filed:

Feb. 04, 2016
Applicant:

Greatbatch Ltd., Clarence, NY (US);

Inventors:

Xiaohong Tang, Williamsville, NY (US);

William C. Thiebolt, Tonawanda, NY (US);

Christine A. Frysz, Orchard Park, NY (US);

Keith W. Seitz, Clarence Center, NY (US);

Robert A. Stevenson, Canyon Country, CA (US);

Richard L. Brendel, Carson City, NV (US);

Thomas Marzano, East Amherst, NY (US);

Jason Woods, Carson City, NV (US);

Dominck J. Frustaci, Williamsville, NY (US);

Steven W. Winn, Lancaster, NY (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 3/18 (2005.12); A61N 1/05 (2005.12); A61N 1/375 (2005.12); H01G 4/30 (2005.12); H01G 4/35 (2005.12); C22C 29/12 (2005.12); H01G 2/10 (2005.12); H01G 4/40 (2005.12); H01G 4/12 (2005.12); H01R 43/00 (2005.12); H02G 3/22 (2005.12); A61N 1/08 (2005.12); H01G 4/005 (2005.12); B23K 35/30 (2005.12); A61N 1/372 (2005.12);
U.S. Cl.
CPC ...
A61N 1/3754 (2012.12); A61N 1/05 (2012.12); A61N 1/08 (2012.12); B23K 35/3013 (2012.12); C22C 29/12 (2012.12); H01G 2/103 (2012.12); H01G 4/005 (2012.12); H01G 4/12 (2012.12); H01G 4/30 (2012.12); H01G 4/35 (2012.12); H01G 4/40 (2012.12); H01R 43/00 (2012.12); H02G 3/22 (2012.12); A61N 1/372 (2012.12); A61N 1/375 (2012.12); Y10T 156/1052 (2015.01);
Abstract

A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.


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