The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2019

Filed:

Jun. 02, 2016
Applicant:

Toshiba Memory Corporation, Tokyo, JP;

Inventors:

Shinji Mikami, Kawasaki, JP;

Ryoichi Inanami, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/01 (2005.12); B41J 2/00 (2005.12); G03F 7/00 (2005.12); B82Y 10/00 (2010.12); B82Y 40/00 (2010.12); H01L 21/67 (2005.12);
U.S. Cl.
CPC ...
G03F 7/0002 (2012.12); B82Y 10/00 (2012.12); B82Y 40/00 (2012.12); H01L 21/6715 (2012.12);
Abstract

Certain embodiments provide an imprint recipe creating device comprising first to fifth creation units. The first creation unit creates inside-standard-shot information by use of filling amount information and residual film thickness information. The second creation unit creates first inside-substrate-surface information by use of shot position information, edge information, and the inside-standard-shot information. The third creation unit creates first correction information by use of unevenness information indicating unevenness in a substrate and unevenness distribution information indicating variations in depth of the unevenness inside the substrate surface. The fourth creation unit creates second correction information by use of post-process information indicating the variations in processing size. The fifth creation unit synthesizes the first inside-substrate-surface information, the first correction information and the second correction information, to create second inside-substrate-surface information.


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