The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2017

Filed:

Dec. 30, 2015
Applicant:

Fontana Technology, Campbell, CA (US);

Inventor:

Mark Jonathan Beck, Los Gatos, CA (US);

Assignee:

Fontana Technology, Campbell, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23G 1/00 (2005.12); C11D 7/00 (2005.12); B08B 3/00 (2005.12); C11D 3/06 (2005.12); H01L 21/02 (2005.12); C11D 7/16 (2005.12); C11D 11/00 (2005.12); B08B 3/04 (2005.12); H01L 21/67 (2005.12); G03F 1/82 (2011.12);
U.S. Cl.
CPC ...
C11D 3/06 (2012.12); B08B 3/04 (2012.12); C11D 7/16 (2012.12); C11D 11/007 (2012.12); C11D 11/0047 (2012.12); G03F 1/82 (2012.12); H01L 21/02057 (2012.12); H01L 21/02087 (2012.12); H01L 21/67051 (2012.12);
Abstract

A method and cleaning solution for cleaning electronic substrates, such as a semiconductor wafers, hard disks, photomasks or imprint molds. The method comprises the steps of contacting a surface of the substrate with a cleaning solution comprised of a polyphosphate, and then removing the cleaning solution from the surface. Additional optional steps include applying acoustic energy to the cleaning solution while the cleaning solution is in contact with the surface, and removing the cleaning solution from the surface by rinsing the surface with a rinsing solution with or without the application of acoustic energy. The cleaning solution comprises a polyphosphate, such as any of the water soluble polyphosphates. Depending on the application, the cleaning solution may also comprise a base and/or a quantity of suspended particles. Complexing agents, amines, biocides, surfactants and/or other substances, may also be added to the cleaning solution.


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