The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2016

Filed:

Jan. 25, 2015
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Osamu Maeda, Kanagawa, JP;

Masaki Shiozaki, Kanagawa, JP;

Takahiro Arakida, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/187 (2005.12); H01S 5/42 (2005.12); H01S 5/022 (2005.12); H01S 5/183 (2005.12); H01S 5/02 (2005.12); H01S 5/042 (2005.12);
U.S. Cl.
CPC ...
H01S 5/423 (2012.12); H01S 5/1838 (2012.12); H01S 5/18341 (2012.12); H01S 5/0217 (2012.12); H01S 5/02272 (2012.12); H01S 5/02276 (2012.12); H01S 5/042 (2012.12); H01S 5/18311 (2012.12); Y10S 438/977 (2012.12);
Abstract

A method of manufacturing a laser diode array capable of inhibiting electric cross talk is provided. The method of manufacturing a laser diode array includes a processing step of forming a peel layer containing an oxidizable material and a vertical resonator structure over a first substrate sequentially from the first substrate side by crystal growth, and then selectively etching the peel layer and the vertical resonator structure to the first substrate, thereby processing into a columnar shape, a peeling step of oxidizing the peel layer from a side face, and then peeling the vertical resonator structure of columnar shape from the first substrate, and a rearrangement step of jointing a plurality of vertical resonator structures of columnar shape obtained by the peeling step to a surface of a metal layer of a second substrate formed with the metal layer on the surface.


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