The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2016

Filed:

Aug. 29, 2013
Applicant:

Renesas Electronics Corporation, Kanagawa, JP;

Inventor:

Kenta Ogawa, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2005.12); C25D 5/02 (2005.12); C23C 30/00 (2005.12); H01L 23/50 (2005.12); H01L 21/60 (2005.12); H01L 21/02 (2005.12); H01L 23/48 (2005.12); H02G 3/08 (2005.12); H01L 23/495 (2005.12); H01L 23/00 (2005.12);
U.S. Cl.
CPC ...
H01L 23/49582 (2012.12); H01L 24/45 (2012.12); H01L 24/48 (2012.12); H01L 2224/29339 (2012.12); H01L 2224/45144 (2012.12); H01L 2224/48091 (2012.12); H01L 2224/48247 (2012.12); H01L 2224/48639 (2012.12); H01L 2224/48644 (2012.12); H01L 2224/85439 (2012.12); H01L 2224/85444 (2012.12); H01L 2924/01013 (2012.12); H01L 2924/01028 (2012.12); H01L 2924/01078 (2012.12); H01L 2924/01079 (2012.12); H01L 2924/19041 (2012.12); H01L 2924/3025 (2012.12);
Abstract

An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.


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