The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2016
Filed:
May. 14, 2014
Ps4 Luxco S.a.r.l., Luxembourg, LU;
Seiya Fujii, Tokyo, JP;
PS4 LUXCO S.A.R.L., Luxembourg, LU;
Abstract
A ball grid array semiconductor device has a wiring substrate (), a semiconductor chip () disposed on one surface side of the wiring substrate, and a bump arrangement () as external terminals disposed on a surface side, opposite to the one surface side, of the wiring substrate. The semiconductor chip is mounted so that the center of the semiconductor chip is shifted from the center of the semiconductor device by one pitch or more of the bump arrangement, and the bump arrangement has a reinforcing structure (-) for a bump array located at a position farthest from the center of the semiconductor device in a shift direction of the semiconductor chip.