The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2016

Filed:

Apr. 22, 2014
Applicant:

Plastic Logic Limited, Cambridge, Cambridgeshire, GB;

Inventors:

Paul A. Cain, Cambridge, GB;

Carl Hayton, Cambridge, GB;

Assignee:

Flexenable Limited, Cambridge, Cambridgeshire, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2005.12); H01L 21/461 (2005.12); H01L 51/00 (2005.12); B23K 26/06 (2013.12); B23K 26/40 (2013.12); H05K 3/02 (2005.12); H01L 21/268 (2005.12); H01L 21/768 (2005.12); H05K 3/46 (2005.12);
U.S. Cl.
CPC ...
H01L 51/0023 (2012.12); B23K 26/063 (2012.12); B23K 26/4075 (2012.12); H05K 3/027 (2012.12); B23K 2201/40 (2012.12); B23K 2203/16 (2012.12); H01L 21/268 (2012.12); H01L 21/76838 (2012.12); H05K 3/4644 (2012.12); H05K 2201/09672 (2012.12);
Abstract

A method of fabricating an electronic device, the device including a plurality of layers on a substrate, the layers including an upper conductive layer and at least one patterned underlying layer between said conductive layer and said substrate. The method includes patterning said underlying layer, and patterning said upper conductive layer by laser ablation using a stepwise process in which successive areas of said upper conductive layer are ablated by successively applied laser patterns. The successively applied laser patterns overlap one another in an overlap region. The method further includes configuring a said laser pattern and said patterned underlying layer with respect to one another such that in a said overlap region said patterned underlying layer is substantially undamaged by said stepwise laser ablation.


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