The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2012
Filed:
Jan. 07, 2009
James N. O'brien, Bend, OR (US);
Lian-cheng Zou, Portland, OR (US);
Yunlong Sun, Beaverton, OR (US);
Kevin P. Fahey, Portland, OR (US);
Michael J. Wolfe, Portland, OR (US);
Brian W. Baird, Oregon City, OR (US);
Richard S. Harris, Portland, OR (US);
James N. O'Brien, Bend, OR (US);
Lian-Cheng Zou, Portland, OR (US);
Yunlong Sun, Beaverton, OR (US);
Kevin P. Fahey, Portland, OR (US);
Michael J. Wolfe, Portland, OR (US);
Brian W. Baird, Oregon City, OR (US);
Richard S. Harris, Portland, OR (US);
Electro Scientific Industries, Inc., Portland, OR (US);
Abstract
UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path () into short segments (), from about 10 μm to 1 mm. The laser output () is scanned within a first short segment () for a predetermined number of passes before being moved to and scanned within a second short segment () for a predetermined number of passes. The bite size, segment size (), and segment overlap () can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path(112)where the cut is already completed. Polarization direction of the laser output () is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths.A multi-step process can optimize the laser processes for each individual layer.