The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2007
Filed:
Oct. 16, 2002
Charles A. Poutasse, Lake Oswego, OR (US);
Charles A. Poutasse, Lake Oswego, OR (US);
Nikko Materials USA, Inc., Chandler, AZ (US);
Abstract
The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formulawherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH, NHR, (NHC(═NH))NH, RCOOH, NR, C(O)NHR, RNR, ROH, RSH, RNHand RNHR, wherein Ris a hydrocarbon group, Ris an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R, ORor SOCH—NH; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.