The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2006
Filed:
Apr. 21, 2003
Martin A. Allen, Gainesville, GA (US);
Martin A. Allen, Gainesville, GA (US);
Nordson Corporation, Westlake, OH (US);
Abstract
A segmented die assembly comprises a plurality of side-by-side and separate units. Each die unit, includes a manifold segment and a die module mounted thereon. The manifold segments are interconnected and function to deliver process air and polymer melt to the modules. Each module including a nozzle through which the polymer melt is extruded forming a row of filament(s). The filaments from the array of modules are deposited on a substrate or collector. The die assembly is preferably used to apply a hot melt adhesive to a substrate, but also may be used to produce meltblown webs.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile