The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2006
Filed:
Dec. 02, 2001
R. Andrew Wood, Bloomington, MN (US);
Jeffrey A. Ridley, Burnsville, MN (US);
Robert E. Higashi, Shorewood, MN (US);
R. Andrew Wood, Bloomington, MN (US);
Jeffrey A. Ridley, Burnsville, MN (US);
Robert E. Higashi, Shorewood, MN (US);
Honeywell International Inc., Morristown, NJ (US);
Abstract
A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, with devices, respectively, and may be divided into a multiplicity of chips.