The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 1997

Filed:

Oct. 30, 1995
Applicant:
Inventor:

Daniel J Vavrick, Beltsville, MD (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156276 ;
Abstract

A thermal bond system is provided for bonding a first component that prods heat to a second component that dissipates heat. Carbon or other thermally conductive fiber tows are woven together to define a fabric mesh having first and second opposing woven surfaces. An adhesive bond that is flowable prior to drying is used to wet and cover the first and second opposing surfaces. The adhesive bond extends into interstices formed between adjacent fiber tows.


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Vavrick, Daniel. (1997). Thermal bond system (U.S. Patent No. H001699). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/H001699

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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