The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 1993
Filed:
May. 25, 1992
Applicant:
Inventors:
William L Wade, Jr, Neptune, NJ (US);
Robert J Mammone, So. Plainfield, NJ (US);
Michael Binder, Brooklyn, NY (US);
Assignee:
The United States of America as represented by the Secretary of the Army, Washington, DC (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K / ;
U.S. Cl.
CPC ...
524487 ;
Abstract
A method is provided of increasing the dielectric breakdown strength of tmoplastic films such as thin films of polypropylene obtained from polypropylene resin powder. The method involves melt extruding the resin powder with a small amount of ceresine wax.
Wade, Jr, William. (1993). Method of increasing dielectric break-down strengths of thermoplastic (U.S. Patent No. H001252). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/H001252
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile