The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 1989
Filed:
Jan. 08, 1987
Francis J Murdoch, Monmouth Beach, NJ (US);
The United States of America as represented by the Secretary of the Army, Washington, DC (US);
Abstract
An arrangement and method for mounting IC chips or dice onto substrates crises the use of (a pair of) electrically conductive electrodes placed on a substrate below the location where the IC chip is to be mounted. The electrodes are separated a distance that is approximately equal to the width of the IC chip to be mounted. A resistor material is disposed between the electrodes, or may even be integral therewith. The IC chip is placed above the resistor material, it is insulated from the latter, and it abuts a layer of bonding material (e.g., eutectic solder or epoxy) on its underside. A voltage applied to the electrodes heats the resistor material which, in turn melts or cures the bonding material to thereby secure the IC chip in place on the substrate.