The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Apr. 19, 2017
Applicants:

Kokusai Electric Corporation, Tokyo, JP;

Toho Kasei Co., Ltd., Nara, JP;

Inventors:

Satoru Murata, Toyama, JP;

Shinya Morita, Toyama, JP;

Masashi Suzuki, Yamatokoriyama, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...

Find Patent Forward Citations

Murata, Satoru. (2019). Sealing material ring for a semiconductor manufacturing apparatus (U.S. Patent No. D862404). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/D862404

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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