The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Feb. 11, 2025
Applicant:
Cj Logistics Corporation, Seoul, KR;
Inventors:
Soo Hyung Lee, Seoul, KR;
Ju Hwan Yoo, Seoul, KR;
Hye Yeon Jeong, Seoul, KR;
Ja Hyun Koo, Seoul, KR;
Oh Sung Kwon, Seoul, KR;
Jung Hoon Park, Seoul, KR;
Hyun Woo Yang, Seoul, KR;
Yu Mi Jeong, Seoul, KR;
Chan Woo Kim, Seoul, KR;
Assignee:
CJ Logistics Corporation, Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
Lee, Soo. (2026). Shock-absorbing material for packaging (U.S. Patent No. D1133908). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/D1133908
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile