The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Dec. 13, 2021
Applicant:
Hiwin Technologies Corp., Taichung, TW;
Inventors:
Jonus Liu, Taichung, TW;
Jheng-Fu Huang, Taichung, TW;
Yi-Chan Tseng, Taichung, TW;
Shou-Yang Huang, Taichung, TW;
Assignee:
Hiwin Technologies Corp., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
Liu, Jonus. (2023). Wafer aligner (U.S. Patent No. D1003327). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/D1003327
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile