The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2018
Filed:
Jun. 07, 2011
Tetsuya Jigami, Hiroshima, JP;
Masayuki Uchida, Hiroshima, JP;
Shinji Makino, Hiroshima, JP;
Tadashi Nakamura, Tokyo, JP;
Takaya Kawasoe, Toyama, JP;
Tetsuya Jigami, Hiroshima, JP;
Masayuki Uchida, Hiroshima, JP;
Shinji Makino, Hiroshima, JP;
Tadashi Nakamura, Tokyo, JP;
Takaya Kawasoe, Toyama, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Abstract
The producing method includes: (I) providing an active energy ray curable resin composition for mold surface release treatment between a mold having uneven microstructure on its surface and a substrate, and after curing the resin composition by irradiation with an active energy ray, peeling off the substrate together with a cured article of the active energy ray curable resin composition from the surface of the mold, thereby performing a release treatment to the surface of the mold; and (II), after step (I), providing an active energy ray curable resin composition for shaping between the substrate and the mold, the surface of which has been treated by the release treatment, and after curing the resin composition by an active energy ray, peeling off the substrate together with a cured article of the active energy ray curable resin composition for shaping from the surface of the mold.