The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Apr. 13, 2015
Applicant:

Lawrence Livermore National Security, Llc, Livermore, CA (US);

Inventors:

Kedar G. Shah, San Francisco, CA (US);

Sarah H. Felix, Oakland, CA (US);

Satinderpall S. Pannu, Pleasanton, CA (US);

Vanessa Tolosa, Oakland, CA (US);

Angela C. Tooker, Dublin, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/04 (2006.01); A61B 5/04 (2006.01); A61N 1/05 (2006.01); A61N 1/378 (2006.01); A61N 1/372 (2006.01); A61B 5/00 (2006.01);
U.S. Cl.
CPC ...
A61B 5/04001 (2013.01); A61N 1/0551 (2013.01); A61N 1/3787 (2013.01); A61N 1/37211 (2013.01); A61N 1/37229 (2013.01); A61B 5/002 (2013.01); A61B 2560/0214 (2013.01); A61B 2560/045 (2013.01); A61B 2562/166 (2013.01);
Abstract

A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.


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