The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Dec. 17, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jin Hyun Cho, Seoul, KR;
Hyong Jun Yoo, Hwaseong-si, KR;
Seo Joon Lee, Suwon-si, KR;
Min Chul Jung, Pyeongtaek-si, KR;
Hyun Jun Jung, Yongin-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); C23C 14/34 (2006.01); H05K 3/00 (2006.01); C23C 14/00 (2006.01); C23C 14/06 (2006.01); C23C 14/08 (2006.01); C23C 14/20 (2006.01); C23C 14/35 (2006.01); C23C 28/00 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/46 (2013.01); C23C 14/0015 (2013.01); C23C 14/0042 (2013.01); C23C 14/0641 (2013.01); C23C 14/08 (2013.01); C23C 14/205 (2013.01); C23C 14/34 (2013.01); C23C 14/352 (2013.01); C23C 28/322 (2013.01); C23C 28/34 (2013.01); C23C 28/345 (2013.01); H04M 1/0283 (2013.01); H05K 3/0041 (2013.01); H05K 2203/085 (2013.01); H05K 2203/095 (2013.01);
Abstract
A multilayer thin film and a method of depositing a multilayer thin film on a surface of a product is provided. The multilayer thin film includes a first layer including a non-conductive material coupled to an object, a second layer including a metallic material coupled to the first layer, and a third layer including a non-conductive material coupled to the second layer.