The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Dec. 15, 2014
Applicant:

GE Embedded Electronics Oy, Helsinki, FI;

Inventor:

Risto Tuominen, Helsinki, FI;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H05K 3/30 (2013.01); H01L 21/486 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/00 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 25/065 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 3/429 (2013.01); H05K 3/4644 (2013.01); H05K 3/4697 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19105 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/0588 (2013.01); H05K 2203/1469 (2013.01);
Abstract

The present invention concerns an electronic module with at least one component embedded in insulating material. The electronic module comprises a first insulating material having a first surface and a second surface and a thickness between the first surface and the second surface, at least one opening through the first insulating material, a second insulating material on the second surface of the first insulating material, at least one component embedded in the second insulating material, at least one conductive pattern in the at least one opening, the at least one conductive pattern having a first surface and a second surface, wherein the second surface faces the second insulating material and the first surface faces away from the second insulating material and a distance between the first surface of the first insulating material and the second surface of the at least one conductive pattern is less or greater than the thickness of the first insulating material, an adhesive between the first insulating material and the at least one component, and connection elements between the at least one conductive pattern and the at least one component. The present invention further concerns a method for fabrication of an electronic module with at least one component embedded in an insulating layer.


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