The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Nov. 27, 2012
Applicants:

Florian Poprawa, München, DE;

Markus Schieber, München, DE;

Christina Schindler, Rohrdorf-Lauterbach, DE;

Jörg Zapf, München, DE;

Inventors:

Florian Poprawa, München, DE;

Markus Schieber, München, DE;

Christina Schindler, Rohrdorf-Lauterbach, DE;

Jörg Zapf, München, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H01L 24/19 (2013.01); H05K 1/0225 (2013.01); H05K 1/115 (2013.01); H05K 1/18 (2013.01); H05K 1/185 (2013.01); H05K 3/30 (2013.01); H05K 3/4038 (2013.01); H01L 2224/18 (2013.01); H05K 1/0243 (2013.01); H05K 3/284 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09336 (2013.01); H05K 2203/1469 (2013.01); Y10T 29/4913 (2015.01);
Abstract

The invention relates to a circuit carrier (), comprising a digital circuit, which contains at least two components () that are electrically connected to each other (). Additionally, an electric shield () is provided. According to the invention, the electric shield () and a conducting path () for electrically connecting the components () are realized by means of a single layered composite (). In particular, the electric shield () and the conducting path () are formed by the same electrically conductive layer, wherein a hole () ensures complete electrical insulation of the conducting path () from the shield (). The invention further relates to a method for producing such a circuit carrier.


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