The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Feb. 15, 2016
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Klaus Elian, Alteglofsheim, DE;

Horst Theuss, Wenzenbach, DE;

Thomas Mueller, Lappersdorf, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/08 (2006.01); B81B 7/00 (2006.01); H04R 1/04 (2006.01); H04R 1/40 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/083 (2013.01); B81B 7/0061 (2013.01); H04R 1/04 (2013.01); H04R 1/406 (2013.01); B81B 2201/0257 (2013.01); H01L 2224/95 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19106 (2013.01); H04R 19/005 (2013.01); H04R 2201/003 (2013.01); H04R 2410/05 (2013.01); H04R 2499/11 (2013.01);
Abstract

A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.


Find Patent Forward Citations

Loading…