logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9998032 B1

PDFFull Text
Date of Patent:
Jun. 12, 2018

Filed:

Sep. 12, 2017

Method of manufacturing a circuit device

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Shigeaki Mashimo, Maebashi, JP;

Fumio Horiuchi, Ashikaga, JP;

Kiyoaki Kudo, Gunma, JP;

Akira Sakurai, Tatebayashi, JP;

Yuhki Inagaki, Kumagaya, JP;

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);

Attorneys:

Polanksy & Associates, P.L.L.C.

Paul J. Polansky

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H02M 7/00 (2006.01); H02M 7/537 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H05K 1/18 (2006.01); H01L 25/00 (2006.01); H01L 23/29 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 25/07 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H02M 7/537 (2013.01); H01L 21/4825 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/3121 (2013.01); H01L 23/4334 (2013.01); H01L 23/49531 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/20753 (2013.01); Y10T 29/4916 (2015.01);
Abstract

In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. First and second transistors and first and second diodes are mounted upper surfaces of island portions of respective first and second leads, and are connected to the respective leads through wirings that connect the transistors and diodes to the bonding portions of the respective leads. Lower surfaces of the island portions are attached to an upper surface of a circuit board, and the circuit board, the transistors, the diodes, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.

Find Patent Forward Citations

Loading…