The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Jul. 17, 2017
Applicant:
National Tsing Hua University, Hsinchu, TW;
Inventor:
Jer-Liang Yeh, Taichung, TW;
Assignee:
NATIONAL TSING HUA UNIVERSITY, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 29/0676 (2013.01);
Abstract
A chip reducing thermal stress of current path thereon, including: a substrate having at least one nanowires zone formed on a surface thereof; and at least one current path formed within the at least one nanowires zone on the surface of the substrate, wherein, the at least one nanowires zone has a function of reducing a thermal stress of the at least one current path.