The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Oct. 23, 2015
Applicant:
Lumileds Llc, San Jose, CA (US);
Inventors:
Qingwei Mo, San Jose, CA (US);
Dirk Paul Joseph Vanderhaeghen, San Jose, CA (US);
Assignee:
LUMILEDS LLC, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/207 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 23/00 (2006.01); H01L 27/15 (2006.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/40 (2013.01); H01L 27/156 (2013.01); H01L 33/54 (2013.01); H01L 33/641 (2013.01); H01L 33/647 (2013.01); H01L 2224/16 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2924/14 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract
A low-cost conductive carrier element provides structural support to a light emitting device (LED) die, as well as electrical and thermal coupling to the LED die. A lead-frame is provided that includes at least one carrier element, the carrier element being partitioned to form distinguishable conductive regions to which the LED die is attached. When the carrier element is separated from the frame, the conductive regions are electrically isolated from each other. A dielectric may be placed between the conductive regions of the carrier element.