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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9997671 B1

PDFFull Text
Expired
Date of Patent:
Jun. 12, 2018

Filed:

Jun. 15, 2015

Composite substrate, semiconductor chip having a composite substrate and method for producing composite substrates and semiconductor chips

Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Johannes Baur, Regensburg, DE;

Berthold Hahn, Hemau, DE;

Volker Haerle, Laaber, DE;

Karl Engl, Pentling, DE;

Joachim Hertkorn, Alteglofsheim, DE;

Tetsuya Taki, Tokyo, JP;

Assignee:

OSRAM Opto Semiconductors GmbH, Regensburg, DE;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Michael Lebentritt

Assistant Examiner:

Jordan Klein

Int. Cl.
CPC ...
H01L 33/32 (2010.01); H01L 33/50 (2010.01); H01L 33/00 (2010.01); H01L 33/08 (2010.01); H01L 21/02 (2006.01); H01L 21/78 (2006.01); H01L 29/02 (2006.01); H01L 33/46 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/32 (2013.01); H01L 21/02612 (2013.01); H01L 21/78 (2013.01); H01L 29/02 (2013.01); H01L 33/0079 (2013.01); H01L 33/08 (2013.01); H01L 33/46 (2013.01); H01L 33/507 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A composite substrate has a carrier and a utility layer. The utility layer is attached to the carrier by means of a dielectric bonding layer and the carrier contains a radiation conversion material. Other embodiments relate to a semiconductor chip having such a composite substrate, a method for producing a composite substrate and a method for producing a semiconductor chip with a composite substrate.

Find Patent Forward Citations

Baur, Johannes. (2018). Composite substrate, semiconductor chip having a composite substrate and method for producing composite substrates and semiconductor chips (U.S. Patent No. 9997671). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9997671

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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