The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Oct. 12, 2016
Applicant:
E I Du Pont DE Nemours and Company, Wilmington, DE (US);
Inventor:
Isao Hayashi, Kanagawa, JP;
Assignee:
E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/4763 (2006.01); H01L 31/0224 (2006.01); B05D 3/00 (2006.01); H01L 31/0216 (2014.01); H01L 31/0236 (2006.01); H01L 31/068 (2012.01); H01L 31/18 (2006.01); H01B 1/16 (2006.01); H01L 31/0352 (2006.01);
U.S. Cl.
CPC ...
H01L 31/022441 (2013.01); B05D 3/007 (2013.01); H01B 1/16 (2013.01); H01L 31/02168 (2013.01); H01L 31/02363 (2013.01); H01L 31/03529 (2013.01); H01L 31/0682 (2013.01); H01L 31/1804 (2013.01); H01L 31/1864 (2013.01); H01L 31/1868 (2013.01); B05D 2203/30 (2013.01); B05D 2601/28 (2013.01);
Abstract
A method for manufacturing a back-contact solar cell, comprising the steps of: (i) preparing a semiconductor substrate comprising an n-layer and a p-layer at the back side of the semiconductor substrate; (ii) applying a conductive paste on both the n-layer and the p-layer, wherein the conductive paste comprises a silver (Ag) powder, a palladium (Pd) powder, an additional metal powder selected from the group consisting of molybdenum (Mo), boron (B) and a mixture thereof, a glass frit, and an organic medium; and (iii) firing the applied conductive paste.