The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Apr. 16, 2014
Applicant:
Sony Corporation, Tokyo, JP;
Inventor:
Takeshi Ichimura, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/3142 (2013.01); H01L 24/16 (2013.01); H01L 24/83 (2013.01); H05K 1/144 (2013.01); H05K 3/305 (2013.01); H05K 3/3436 (2013.01); H05K 3/363 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 24/91 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/20106 (2013.01); H01L 2924/20107 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1305 (2013.01); Y02P 70/613 (2015.11);
Abstract
A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures.